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The company has a third-generation semiconductor Chinese R&D team, focusing on nano-sized surface treatment, and its core technology is the preparation of micro and nanostructures on GaN and SiC surfaces. Compared with the device without surface structure treatment of n-GaN, the light output power of vertical blue LED is at least doubled; The el of encapsulated LED devices is enhanced by > 17%; Suitable for different chip designs such as side flow, vertical, or thin-film flip-chip; The method is fast (< 1 hour), and its cost is low and can be used in a large area; Existing production lines can be used. The current founder seeks domestic partners.